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Amkor Technology, Inc.

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Amkor Technology, Inc. provides outsourced semiconductor packaging and test services to integrated device manufacturers, fabless semiconductor companies, and contract foundries worldwide. Headquartered in Tempe, Arizona, the company operates as one of the world's largest providers of semiconductor assembly and test services, with manufacturing facilities across Asia, including South Korea, the Philippines, China, Japan, Taiwan, and Vietnam. Amkor offers a comprehensive portfolio of advanced packaging and test technologies, including flip chip, wafer-level processing, and system-in-package solutions that serve diverse end markets such as automotive, communications, computing, consumer electronics, and industrial applications. The company employs approximately 30,000 people globally and generates annual revenues exceeding $6 billion. In 2024, Amkor announced plans to establish its first advanced packaging facility in Peoria, Arizona, representing a $2 billion investment supported by funding from the CHIPS and Science Act. This facility aims to address growing domestic demand for advanced packaging capabilities in the United States. The company maintains long-standing relationships with leading semiconductor manufacturers and benefits from increasing complexity in chip packaging requirements driven by artificial intelligence, high-performance computing, and advanced automotive electronics. Amkor competes primarily with ASE Technology Holding, JCET Group, and Powertech Technology in the outsourced semiconductor assembly and test market.